By Duixian Liu; et al

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A hybrid circuit technology is used to mount semiconductor components as bare die on a thin-film substrate. The process features bare die wire or ribbon bonding, beam lead, flipchip, or surface mount device (SMD) mounting. The process supports 4 µm gold conductors, laser trimmable NiCr thin-film resistors, SiN thin-film capacitors, air bridges, and via holes. 27 mm). 9). Transmission lines are realized as microstrip, co-planar waveguide (CPW), or slotline. g. 20 or more. Individual substrates are clamped into the package, which simplifies the assembly and disassembly process.

Reproduced by permission of © IBM. to integrate mmWave components in the same way as we have shrunk the size of cell phones and computer chips? Why are many of today’s mmWave systems still similar in size to those used a hundred years ago? 2, for instance, shows a photo of a bulky 60 GHz radio receiver that has been built from discrete components. The answer to this question is simple. First, one needs active devices that are fast enough to operate in the mmWave frequency range, and second, one has to be able monolithically to integrate many of them with their interconnects on a single die.

EBG materials are created from dielectric and/or metallic structures that are periodic in one or more dimensions. One- and two-dimensional structures will be presented and analyzed and then a discussion ensues of how ‘defects’ can be added to create devices and waveguides that control the propagation of electromagnetic waves. High impedance ground planes are introduced that reduce surface waves and increase efficiency and are shown to be useful for corrugated horn antennas and other structures.

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